|
       
 |
|
Reviews
in Advanced Sciences and Engineering ISSN:
2157-9121 (Print): EISSN: 2157-913X (Online) Copyright
© 2000-
American Scientific Publishers. All Rights Reserved.
|
| |
| EDITOR-IN-CHIEF |
Professor Ahmad Umar Department
of Chemistry, Faculty of Science Advanced Materials and
Nano-Engineering Laboratory (AMNEL) Centre for Advanced
Materials and Nano-Engineering (CAMNE) Najran University, P.O.
Box: 1988, Najran 11001, Kingdom of Saudi Arabia Phone:
+966-534-574-597 Fax: +966-7-5442-135 Email:
rase.asp@gmail.com
|
EUROPEAN
EDITOR Prof.
G. F. Cerofolini Department of Materials
Science University of Milano-Bicocca, Milano, Italy
ASIAN
EDITOR Prof.
Dongfeng XUE Department of Materials
Science and Chemical Engineering Dalian University of
Technology, Dalian, PR China
ASSOCIATE
EDITORS Prof.
Ahmed A. Al-Ghamdi King Abdulaziz
University, Kingdom of Saudi Arabia
Prof.
Mohd. Sayeed Akhtar Jimma-University,
Ethiopia
Prof.
S. G. Ansari Jamia Millia Islamia, India
Prof.
Abdul-Majeed Azad The University of
Toledo, USA.
Prof.
S. Baskoutas University of Patras, GREECE
Prof.
Rabah BOUKHERROUB Institut de Recherche
Interdisciplinaire (IRI, USR CNRS 3078), France
Prof.
Yulong Ding University of Leeds, UK
Dr.
Alessia Le Donne University of Milano-Bicocca via
Cozzi 53, 20125 Milano, Italy
Dr.
Antoine Ferreira Institute PRISME, ENSI
Bourges, France
Dr.
Anupama B. Kaul California Institute of
Technology, CA
Prof.
Jong-Heun Lee Korea University, South
Korea
Dr.
Keyan Li Dalian University of Technology,
P. R. China
Prof.
Zhiqun Lin Georgia Institute of
Technology, USA
Prof.
Amitava Patra Indian Association for the
Cultivation of Science, India
Prof.
Pierre Ferdinand Poudeu Poudeu University
of New Orleans, USA
Prof.
Guozhen Shen Huazhong University of
Science and Technology, China
Prof.
Kengo Shimanoe Kyushu University, JAPAN
Prof.
Hong Yang The University of Western
Australia, Australia
Prof.
Changhui Ye Institute of Solid State
Physics, CAS, Hefei, China
Prof.
Haibo Zeng Nanjing University of
Aeronautics and Astronautics (NUAA), China
Prof.
Fangfang Zhang The Xinjiang Technical
Institute of Physics and Chemistry, China
|
ADVISORY
BOARD MEMBERS Prof. Ravi Pandey,
Michigan Tech University USA Prof. Federico Rosei,
University du Quebec, Canada Prof. C. N. R. Rao,
Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore,
India Prof. Hongjie Zhang, Changchun Institute of
Applied Chemistry, Chinese Academy of Sciences, China Prof.
Henryk Ratajczak, University of Wroclaw, Poland Prof.
S. Thomas, School of Chemical Sciences, Mahatma Gandhi
University, India
|
INTERNATIONAL
EDITORIAL BOARD MEMBERS Prof. Qiang Wang,
College of Environmental Science and Engineering, Beijing Forestry
University, China Dr. Abdullah S. G. Alghamdi, King
Fahad National Hospital, Jeddah, Saudi Arabia Dr. A. M.
Stephan, Central Electrochemical Research Institute, Karaikudi,
India Dr. C. Ribeiro, Embrapa Instrumentacao
Agropecuaria, Brazil Prof. D. Narducci, University of
Milano Bicocca, Italy Dr. E. De la Rosa, Centro de
Investigaciones en Optica, México Prof. Falleh R. M.
Al-Solamy, Department of Mathematics, University of Tabuk, Saudi
Arabia Prof. H. C. Zeng, National University of
Singapore, Singapore Prof. Ihab Obaidat, College of
Science, United Arab Emirates University (UAEU), United Arab
Emirates Dr. Jun Liu, Key Laboratory of Low Dimensional
Materials and Application Technology, Xiangtan University, Hunan,
China Dr. Jun Liu, Xiangtan University, Xiangtan, China
Prof. K. Lee, Yonsei University, South Korea Prof.
M. S. Akhtar, Chonbuk National University, South Korea Prof.
M. S. Chauhan, Himachal Pradesh University, Shimla, India Dr.
P. Ganeshan, University of South Carolina, Columbia, SC 29208
Prof. R. I. Badran, The Hashemite University, Jordan
Prof. Shihe Yang, The Hong Kong University of Science
and Technology, China Prof. S. K. Mehta, Panjab
University, Chandigarh, India Prof. Xiaojun Gu, Inner
Mongolia University, Hohhot, China
|
| |
| |
| |
| |
| |
| |
Terms and
Conditions
Privacy Policy Copyright
© 2000-
American Scientific Publishers. All Rights Reserved. |
|