Journal of Advanced Microscopy Research ISSN: 2156-7573 (print); EISSN: 2156-7581 (online) Copyright © 2000-2012 American Scientific Publishers. All rights reserved
			EDITOR-IN-CHIEF
			Prof. Dr. Vladimir A. Basiuk Instituto de Ciencias Nucleares Universidad Nacional Autónoma de México Circuito Exterior C.U., A. Postal 70-543 04510 México, D.F., MEXICO Phone: +52-55-5622-4739, Ext. 2224               +52-55-5622-4675 Fax: +52-55-5622-4693 E-mail: basiuk@nucleares.unam.mx
			EUROPEAN EDITOR
			Prof. Dr. Stanislav N. Gorb Department of Functional Morphology and Biomechanics Zoological Institute at the University of Kiel Am Botanischen Garten 1–9 D-24098 Kiel, GERMANY Tel: +49-431-880-4513 Fax: +49-431-880-1389 Email: sgorb@zoologie.uni-kiel.de
			ASIAN EDITOR
			Professor San-Qiang Shi Department of Mechanical Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon, Hong Kong, CHINA Tel: +852-2766-7821 Fax: +852-2365-4703 Email: mmsqshi@polyu.edu.hk
			AUSTRALIAN EDITOR:
			Professor Marion Stevens-Kalceff School of Physics The University of New South Wales Sydney 2052, AUSTRALIA Phone: +612-9385-5928 Fax: +612-9385-6060 E-mail: Marion.Stevens-Kalceff@unsw.edu.au
			ASSOCIATE EDITORS Dr. Aleksandra Djurišic, The University of Hong Kong, Hong Kong, China; E-mail: dalek@hku.hk Prof. S. W. Hla, Ohio University, USA; E-mail: hla@helios.phy.ohiou.edu Prof. Dr. Tilman Schäffer, Universität Erlangen-Nürnberg, Germany; E-mail: tilman.schaeffer@physik.uni-erlangen.de
			EDITORIAL BOARD S. Bandyopadhyay, University of New South Wales, Australia E. V. Basiuk, Universidad Nacional Autónoma de México, Mexico L. A. Bottomley, Georgia Institute of Technology, USA N. Chandrasekhar, Institute of Materials Research and Engineering, Singapore S. De Feyter, Katholieke Universiteit Leuven, Belgium W. Jhe, Seoul National University, South Korea J. Kröger, Christian-Albrechts-Universität zu Kiel, Germany P. Kruse, McMaster University, Canada C. M. Lieber, Harvard University, USA H. Onishi, Kobe University, Japan J. Piper, Clinic Meduna, Germany U. S. Schubert, Eindhoven University of Technology, Netherlands Z. F. Shao, University of Virginia Medical School, USA W. Sigmund, University of Florida, USA Q. Tang, Hong Kong Polytechnic University, China G. Julius Vancso, University of Twente, Netherlands Y. Wu, National University of Singapore, Singapore X. D. Xiao, Hong Kong University of Science and Technology, China M. J. Yacaman, University of Texas at San Antonio, USA
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