EDITORIAL BOARD
	EDITOR-IN-CHIEF
	Dr. Patrick GIRARD Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM) 161 rue Ada, 34392 Montpellier cedex 05, FRANCE Tel.: (+33) 467 418 629 Fax: (+33) 467 418 500 Email: girard@lirmm.fr
	EDITORIAL BOARD
	E. Acar, IBM Research Laboratory., USA A. J. Acosta, University of Sevilla, Spain B. M. Al-Hashimi, University of Southampton, UK Mohab H. Anis, University of Waterloo, Canada M. Ansorge, EPFL and University of Neuchatel, Switzerland S. Badrudduza, Freescale Semiconductors Inc., USA M. J. Bellido, University of Sevilla, Spain L. Benini, University of Bologna, Italy S. Bhunia, Case Western Reserve University, USA E. I. Boemo, University of Autonoma Madrid, Spain Y. Cao, Arizona State University, USA M. Chan, Hong Kong University of Science & Technology, China N. Chang, Seoul National University, South Korea D. Chen, University of Illinois, Urbana-Champaign, USA K. Choi, Seoul National University, South Korea V. De, Intel Corporation, USA W. Dehaene, KU Leuven, Belgium J. Figueras, University Polytechnic Catalunya, Spain E. G. Friedman, University of Rochester, USA A. García-Ortiz, Anafocus, Spain K. Ghose, State University of New York, Binghamton, USA E. Guidetti, STMicroelectronics Inc., Switzerland Y. Ha, National University of Singapore, Singapore J. Haid, Infineon Technologies, Austria J. Henkel, University of karlsruhe, Germany M. Hirech, Synopsys Inc. USA T. Ishihara, Kyushu University, Japan N. Jha, Princeton University, USA J. Kim, Seoul National University, South Korea M.J. Kumar, Indian Institute of Technology, Delhi, India E. Kursun, IBM Thomas J. Watson Research Labs, USA A. K. Jones, University of Pittsburgh, USA J. D. Legat, Universite Catholique de Louvain, Belgium P. Li, Texas A&M University, USA X. Li, Chinese Academy of Sciences, Beijing, China C. Lichtenau, IBM Research Labs., Germany E. Macci, Politecnico di Torino, Italy Y. Manoli, University of Freiburg, Germany M. Miranda, IMEC, Belgium N. Muralimanohar, HP Labs, USA V. Narayanan, Pennsylvania State University, USA S. Nazarian, Magma Design Automation, USA W. Nebel, University of Oldenburg, Germany W.T. Ng, University of Toronto, Canada B. Nikolic, University of California at Berkeley, USA Vojin G. Oklobdzija, University of Texas at Dallas, USA R. Panda, Sun Microsystems, USA B. C. Paul, Toshiba America Research, USA M. Pedram, University of Southern California, USA P. Petrov, University of Maryland, USA C. Piguet, CSEM, Switzerland J. Pineda de Gyvez, NXP Semiconductors, The Netherlands A. Raghunathan, Purdue University, USA C. P. Ravikumar, Texas Instruments, India M. Renaudin, TIEMPO SAS, France G. A. Rincón-Mora, Georgia Institute of Technology, USA K. Roy, Purdue University, USA R. Sankaralingam, Cadence Design Systems, USA M. Sarrafzadeh, UCLA, USA O. Sentieys, ENSSAT University of Rennes, France L. Shang, University of Colorado at Boulder, USA R. Singh, Clemson University, USA D. Soudris, National Technical University of Athens, Greece M.R. Stan, University of Virginia, USA N. T. Tchamov, Tampere University of Technology, Finland M. Tehranipoor, University of Connecticut, USA J. P. Teixeira, Institute of Systems and Computer Engineering, Portugal N. A. Touba, University of Texas at Austin, USA T. Tuan, Xilinx Research Labs., USA A. Tyagi, Iowa State University, USA K. Uchiyama, Hitachi, Ltd., Japan X. Vera, Intel Labs, Spain S. Verma, Conexant Inc., USA G. Y. Wei, Harvard University, USA P. Wong, Stanford University, USA H. J. Wunderlich, University of Stuttgart, Germany H. Yang, Tsinghua University, China S. Yoo, Postech University, South Korea H. Yu, Nanyang Technological University, Singapore
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